Post Etch Removers

950 PMMA A 11

High resolution positive resist designed to be used as a protective coating for wafer thinning.

Bottle

Chip Manufacturing

EBR (Edge Bead Remover)

Solvent designed for photoresist edge bead removal

Bottle

Chip Manufacturing

EKC 265

EKC® 265 is a trademarked formulation made by DuPont that functions as a Aluminum post-etch residue remover in the semiconductor fabrication and packaging industries.

Bottles and Drums

Chip Manufacturing

EKC 270

EKC® 270 is a trademarked formulation made by DuPont that functions as a Aluminum post-etch residue remover in the semiconductor fabrication and packaging industries.

Bottles and Drums

Chip Manufacturing

EKC 830

EKC® 830 is a trademarked formulation made by DuPont, designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.

Bottles and Drums

Chip Manufacturing

EKC 922

EKC® 922 is a trademarked formulation made by Dupont and is a universal remover that is formulated to remove both negative and positive photoresist

Bottles and Drums

Chip Manufacturing

LOR 5B

This material is primarily used as an underlying layer in the lift-off process and allows for optimal lift-off when creating an undercut

Bottle

Chip Manufacturing

Nano-Strip

Nano-Strip® is a stabilized formulation of sulfuric acid and hydrogen peroxide compounds. It removes positive and negative resists and other organic materials used in various applications of semiconductor photolithography.

Bottle

Chip Manufacturing

Sulfuric Acid / Hydrogen Peroxide Blend

This blend is designed to remove trace amounts of photoresist from substrates

Pail

Chip Manufacturing