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Photoresist Additives

Product Name
Description
Packaging Options
Applications
1827 Photoresist
Advanced IC device fabrication positive photoresist system
Bottle
Chip Manufacturing
AZ 10XT, 520CPS
Photoresist with a lower optical absorption to simplify exposure for thick resist films. They are compatible with MIF (TMAH) or inorganic developers
Bottle
Chip Manufacturing
AZ 4330
Photoresist designed for improved adhesion to substrates
Bottle
Chip Manufacturing
HPR504 Positive Photoresist
Positive Photoresist chemistry manufactured by Fujifilm
Bottle
Chip Manufacturing
S1813 Photoresist
Positive Photoresist system for advanced IC device fabrication
Bottle
Chip Manufacturing
S1818 Photoresist
Positive Photoresist system for advanced IC device fabrication
Bottle
Chip Manufacturing
Type 3 IC Resist
Designed for applications employing from 0.75 to 2.0 µm coatings for exposure on projection, proximity and contact printers, manufactured by Fujifilm
Bottle
Chip Manufacturing
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