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Product Name | Description | Packaging Options | Applications |
|---|---|---|---|
950 PMMA A 11 | High resolution positive resist designed to be used as a protective coating for wafer thinning. | Bottle | Chip Manufacturing |
EBR (Edge Bead Remover) | Solvent designed for photoresist edge bead removal | Bottle | Chip Manufacturing |
EKC 265 | EKC® 265 is a trademarked formulation made by DuPont that functions as a Aluminum post-etch residue remover in the semiconductor fabrication and packaging industries. | Bottles and Drums | Chip Manufacturing |
EKC 270 | EKC® 270 is a trademarked formulation made by DuPont that functions as a Aluminum post-etch residue remover in the semiconductor fabrication and packaging industries. | Bottles and Drums | Chip Manufacturing |
EKC 830 | EKC® 830 is a trademarked formulation made by DuPont, designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove. | Bottles and Drums | Chip Manufacturing |
EKC 922 | EKC® 922 is a trademarked formulation made by Dupont and is a universal remover that is formulated to remove both negative and positive photoresist | Bottles and Drums | Chip Manufacturing |
LOR 5B | This material is primarily used as an underlying layer in the lift-off process and allows for optimal lift-off when creating an undercut | Bottle | Chip Manufacturing |
Nano-Strip | Nano-Strip® is a stabilized formulation of sulfuric acid and hydrogen peroxide compounds. It removes positive and negative resists and other organic materials used in various applications of semiconductor photolithography. | Bottle | Chip Manufacturing |
Sulfuric Acid / Hydrogen Peroxide Blend | This blend is designed to remove trace amounts of photoresist from substrates | Pail | Chip Manufacturing |
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